Conductive diamond application system

ABSTRACT

A system is provided. The system includes a 3D printer, which includes a first dispenser and a second dispenser. The first dispenser is configured to apply conductive material to a surface, and the second dispenser is configured to apply conductive diamonds to a surface. The conductive material includes a mixture of an elastomer and at least one of nickel and silver, and the conductive diamonds are between 1 and 10 microns in size.

CROSS REFERENCE TO RELATED APPLICATION(S)

This application is a Divisional of pending non-Provisional U.S.application Ser. No. 15/792,275 filed Oct. 24, 2017, entitled CONDUCTIVEDIAMOND APPLICATION METHOD AND SYSTEM, which is hereby incorporated byreference for all purposes.

FIELD

The present invention is directed to application systems for conductivediamonds. In particular, the present invention is directed to 3Dprinting systems for conductive diamonds.

BACKGROUND

Naturally occurring diamonds are generally electrical insulators.However, with certain known doping and other treatment techniques,diamonds may become electrically conductive. Synthetic diamonds may bemanufactured to have certain electrical conduction properties. Diamondsare often desired for applications where extreme hardness is desirable,including as abrasives.

SUMMARY

In accordance with embodiments of the present invention, a method isprovided. The method includes preparing a surface to receive a 3Dprinted layer, 3D printing a conductive layer comprising a plurality ofoverlaid layers of conductive material to the surface, and 3D printingconductive diamonds to the conductive layer. Preparing the surfaceincludes one or more of texturing the surface and chemically treatingthe surface. The texturing is performed in order to not adversely impactregularity of the surface and limit variations in the height from thesurface of conductive diamonds. Chemically treating the surface reducesfilms or coatings that may impact adhesion between the surface and theconductive layer, without degrading the conductive layer.

In accordance with another embodiment of the present invention, a systemis provided. The system includes a 3D printer, which includes a firstdispenser for applying conducting material to a surface and a seconddispenser for applying conductive diamonds to a surface. The conductingmaterial includes a mixture of an elastomer and at least one of nickeland silver and conductive diamonds between 1 and 10 microns in size.

In accordance with yet another embodiment of the present invention, asystem is provided. The system includes a file and a 3D printer. Thefile is configured to define one or more programmed areas of a surfaceand the 3D printer is configured to apply a conductive material and oneor more conductive diamonds to the surface based on the file. Theconductive material includes one or more of an elastomer, nickel, andsilver.

An advantage of the present invention is it provides a low-cost methodof applying diamonds to a surface. Diamonds have exceptional hardnessand when conductive are able to make a strong electrical frictionconnection with a mating surface. Diamonds are able to penetrate oxidesand other contaminants on the surface of components, and whenconductive, to provide a low resistive connection between components inhigh speed signaling applications.

Another advantage of the present invention is it takes advantage of 3Dprinting processes to apply various insulating and conductive materialsto a wide range of surfaces. 3D printing has evolved as a reliable wayof applying solid and liquid materials to various surfaces. 3D printedconductive layers act as a binder to retain conductive diamonds inproximity to the surface of the conductive layer or layers.

Yet another advantage of the present invention is it provides theability to apply conductive layers in well-controlled thicknesses. 3Dprinters apply conductive material in layers in order to build up theconductive layers to a predetermined thickness.

Additional features and advantages of embodiments of the presentinvention will become more readily apparent from the followingdescription, particularly when taken together with the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is an illustration depicting conductive material application inaccordance with embodiments of the present invention.

FIG. 1B is an illustration depicting conductive diamonds application inaccordance with embodiments of the present invention.

FIG. 2A is an illustration depicting 3D printing a conductor inaccordance with embodiments of the present invention.

FIG. 2B is an illustration depicting 3D printing conductive diamonds inaccordance with embodiments of the present invention.

FIG. 2C is an illustration depicting simultaneous 3D printing conductorand conductive diamonds in accordance with embodiments of the presentinvention.

FIG. 3A is a flowchart illustrating a process for 3D printing materialand diamonds to a surface in accordance with embodiments of the presentinvention.

FIG. 3B is a flowchart illustrating a process for simultaneously 3Dprinting material and diamonds to a surface in accordance withembodiments of the present invention.

DETAILED DESCRIPTION

The present invention is directed to methods and systems for applyingconductive diamonds by 3D printing processes to a variety of objects. 3Dprinters apply liquid and solid materials in various forms andcombinations. Although 3D printers may be best known for fabricatingsimple three-dimensional ornamental objects from sprayed polymermaterials, other applications have emerged based on improvements in 3Dprinting technology and materials. Current 3D printers utilize extrusiondeposition, granular material binding, lamination, photo polymerization,powder fed directed energy deposition, metal wire processes, andcontinuous liquid interface production. 3D printing processes are alsoknown is additive manufacturing processes. 3D printers are now able toapply materials under computer control in sophisticated and increasinglyfine pitched applications.

Previous application methods for applying conductive diamonds haveinvolved component submersion in a hot bath with electroless Nickel. Inaddition to being slow and time consuming, Nickel can be difficult towork with and hard to control in small areas since it requires masks toprevent plating in specified areas. 3D printing conductive diamonds issignificantly faster and does not need to involve masks or otherpreparatory steps other than possibly surface preparation to aidadhesion. The 3D printed layers and conductive diamonds are only appliedto pre-programmed specific areas on the surface of a workpiece.

In addition to additively applying amorphous materials and compounds, 3Dprinters are able to apply discrete non-amorphous materials such as verysmall diamonds. Diamonds are useful in many industrial applicationsbased on hardness, abrasives, and other unique characteristics. Althoughdiamonds are naturally insulators, in some cases diamonds may be createdor treated in order to have electrically conductive properties. Whencombined with conventional amorphous conductive materials, diamonds mayprovide a rougher surface with valuable abrasive qualities thatfacilitate electrical conduction. For example, by 3D printing anelectrical connector shell with conductive diamonds embedded into a 3Dprinted amorphous conductive layer, in improved electrical connection toa mate of the shell may be provided. Conductive diamonds, because ofsharpness and hardness, penetrate oxides, contaminants, and other highresistivity barriers between electrical components and therefore canprovide improved electrical performance over applications not including3D printed conductive diamonds.

In order to apply conductive diamonds by 3D printing processes, it isimportant to use diamonds within a range of sizes, or diameters.Conductive diamonds should be between 1 and 10 microns in size, andpreferably 3-5 microns for better consistency and evenness inapplication using compressed gases or solvents. Larger diamonds than 10microns may fall out of an aerosol quickly and therefore may not beevenly distributed.

Referring now to FIG. 1A, an illustration 100 depicting conductivematerial application in accordance with embodiments of the presentinvention is shown. The 3D printed conductive layer 112 adheres to thesubject item surface 108, and acts as a binder for the application ofconductive diamonds.

In one embodiment, the 3D printed conductive layer 112 includes anelastomer and at least one of nickel and silver. The elastomer may aidadhesion between the subject item surface 108 and the 3D printingconductive layer 112. In another embodiment, the 3D printed conductivelayer 112 includes only nickel and/or silver. Metallic components of the3D printed conductive layer 112 are applied by known processes includingselective laser sintering. In yet another embodiment, the 3D printedconductive layer 112 includes electrically conductive polymer orpolymers. Polymers may be easier to apply in some circumstances, and mayhave improved elastomeric properties over metallic compounds forretaining conductive diamonds.

Referring now to FIG. 1B, an illustration 116 depicting conductivediamonds application in accordance with embodiments of the presentinvention is shown. After the 3D printed conductive layer 112 is appliedover the subject item surface 108, conductive diamonds 120 are appliedby 3D printer and embedded in the 3D printed conductive layer 112. Inone embodiment, the conductive diamonds 120 are applied by the 3Dprinter after the 3D printed conductive layer 112 is applied. In anotherembodiment, the conductive diamonds 120 are applied concurrently withthe 3D printed conductive layer 112. This will depend on the curing timeof the 3D printed conductive layer 112 and the ability of the conductivediamonds 120 to permanently “embed” in the surface of the 3D printedconductive layer 112.

In the preferred embodiment, the size of the conductive diamonds 124determines the thickness of the 3D printed conductive layer 112. Thatis, the 3D printed conductive layer 112 has a thickness greater than thelargest of the conductive diamonds 120. This may be important dependingon the resistance of the 3D printed conductive layer 112 to pressurefrom the conductive diamonds 120 when the subject item 104 is mated to amating surface, in order to prevent the conductive diamonds 120 frompushing through the 3D printed conductive layer 112 and making contactwith the subject item surface 108.

Referring now to FIG. 2A, an illustration 200 depicting conductivematerial application in accordance with embodiments of the presentinvention is shown. In this embodiment, the 3D printed conductive layer112 may be directly applied to the subject item surface includingconductive material 204. A first dispenser for applying conductivematerial 212 of a 3D printer applies the conductive material 216 to apredefined application area for conductive material 208. The 3D printedconductive layer 112 is built up by the application of 3D printedconductive material 216 in layers until a desired predefined thicknesshas been achieved. Typically, the predefined area 208 is in a softwarefile that controls operation of the 3D printer and directs the firstdispenser 212 to apply the conductive material 216 to predefinedthickness and in a predefined area 208. In one embodiment, theapplication area 208 defines one or more higher-wear areas that areintended to receive a thicker application of 3D printed conductivematerial 216 than other areas of the application area 208. It isimportant that the properties of the 3D printed conductive material 216,and potentially the surface treatment of the subject item surface 204,are compatible in order to maximize adhesion between the 3D printedconductive layer 112 and the subject item surface 108.

Referring now to FIG. 2B, an illustration 220 depicting conductivediamonds application in accordance with embodiments of the presentinvention is shown. After the 3D printed conductive layer 112 is appliedover the subject item surface 108, conductive diamonds 120 are appliedby 3D printer and embedded in the conductive layer 112. In oneembodiment (FIG. 2C), a 3D printer applies the conductive diamonds 120after the 3D printed conductive layer 112 is applied. In anotherembodiment (FIG. 2B), the conductive diamonds 120 are appliedconcurrently with the 3D printed conductive layer 112. This will dependon the curing time of the 3D printed conductive material 216 and theability of the conductive diamonds 120 to permanently “embed” in thesurface of the 3D printed conductive layer 112.

A second dispenser 224 for applying conductive diamonds mixed with acompressed gas or solvent 228 projects 3D printed diamonds in a medium232 to an application area for conductive material 208. The mediumincludes compressed gas or solvent 228. Typically, the application area208 is in a software file that controls operation of the 3D printer anddirects the second dispenser 224 to apply the conductive material 216 toa predefined thickness and in a predefined area 208. In one embodiment,the application area 208 defines one or more higher-wear areas that areintended to receive a thicker application of 3D printed diamonds in amedium 232 than other areas of the application area 208.

In the preferred embodiment, the size of the conductive diamonds 124determines the thickness of the 3D printed conductive layer 112. Thatis, the 3D printed conductive layer 112 has a thickness greater than thelargest of the conductive diamonds 120. This may be important dependingon the resistance of the 3D printed conductive layer 112 to pressurefrom the conductive diamonds 120 when the subject item 104 is mated to amating surface, in order to prevent the conductive diamonds 120 frompushing through the 3D printed conductive layer 112 and making contactwith the subject item surface 108.

Referring now to FIG. 2C, an illustration depicting simultaneous 3Dprinting conductor and conductive diamonds 236 in accordance withembodiments of the present invention is shown. In some embodiments, itmay be desirable to simultaneously apply the 3D printed conductivematerial 216 and the 3D printed diamonds in a medium 232 concurrently.For example, if the 3D printed conductive material 216 sets up or curesquickly, it may be necessary to provide for concurrent application toensure the conductive diamonds 120 are embedded in the surface of the 3Dprinted conductive material 216

Simultaneous application of conductive material 216 and conductivediamonds 120 requires two different dispensers operating at the sametime. A first dispenser 212 applies the conductive material 216 while asecond dispenser 224 applies the conductive diamonds in a medium 232,where the medium includes compressed gas or solvent 228. In a firstembodiment, the first dispenser 212 “leads” the second dispenser 224 toapply the 3D printed conductive material 216 to the subject item surface108 just before the conductive diamonds 120. In a second embodiment, thefirst dispenser 212 and the second dispenser 224 apply the 3D printedconductive material 216 and conductive diamonds 120 to the same areas208 of the subject item surface 108 at the same time.

Referring now to FIG. 3A, a flowchart illustrating a process for 3Dprinting material and diamonds to a surface in accordance withembodiments of the present invention is shown. Flow begins at block 404.

At block 304, in all cases, it may be necessary to prepare the subjectitem surface 108 prior to 3D printing any of the layers 112 orconductive diamonds 120. Preparing the subject item surface 108 ensuresthat the 3D printed conductive layer 112 will securely adhere to thesubject item surface 108 and not shift or separate. In one embodiment,the subject item surface 108 is mechanically textured in order toproduce an irregular surface the layers 112 may adhere to. Theaggressiveness of the texturing should be minimized in order that thetexturing does not adversely impact the regularity of the subject mattersurface 108 or variation in the eventual height of the conductivediamonds 120, relative to the subject matter surface 108. In otherembodiments, the subject item surface 108 may be chemically treated inorder to reduce films or coatings that may adversely impact adhesionwith the layers 112. The chemicals used will depend on the nature offilms or coatings that may be present as well as material properties oflayers 112, and must be selected in order to not degrade the material oflayers 112. Flow proceeds to block 308.

At block 308, a 3D printer applies conductive material 216 over thesubject item surface 108. The conductive material 216 is built up inlayers in order to achieve a desired thickness. The built-up thicknessof the conductive material 216 may be uniform throughout an applicationarea for conductive material 208, or have variable thickness within theapplication area for conductive material 208. Flow proceeds to block312.

At block 312, the 3D printer applies conductive diamonds 120 over theconductive material 216. Where the conductive diamonds 120 are applied,preferably the conductive diamonds 120 are applied with a consistentlyeven density. Flow proceeds to optional block 316.

At optional block 316, the conductive material 216 is cured. In oneembodiment, heat is used to cure the conductive material 216. In anotherembodiment, infrared energy (IR) is used to cure the conductive material216. In yet another embodiment, spray chemical compounds are used tocure the conductive material 216. Block 316 is optional since in someembodiments the conductive material 216 is self-curing and does notrequire the influence of a curing agent to set. Flow ends at optionalblock 316.

Referring now to FIG. 3B, a flowchart illustrating a process forsimultaneously 3D printing material and diamonds to a surface inaccordance with embodiments of the present invention is shown. Flowbegins at block 304.

At block 304, in all cases, it may be necessary to prepare the subjectitem surface 108 prior to 3D printing any of the layers 112 orconductive diamonds 120. Preparing the subject item surface 108 ensuresthat the 3D printed conductive layer 112 will securely adhere to thesubject item surface 108 and not shift or separate. In one embodiment,the subject item surface 108 is mechanically textured in order toproduce an irregular surface the layers 112 may adhere to. Theaggressiveness of the texturing should be minimized in order that thetexturing does not adversely impact the regularity of the subject mattersurface 108 or variation in the eventual height of the conductivediamonds 120. In other embodiments, the subject item surface 108 may bechemically treated in order to reduce films or coatings that mayadversely impact adhesion with the layers 112. The chemicals used willdepend on the nature of films or coatings that may be present as well asmaterial properties of layers 112, and must be selected in order to notdegrade the material of layers 112. Flow proceeds to blocks 308 and 312.

At block 308, a 3D printer applies conductive material 216 over thesubject item surface 108. The conductive material 216 is built up inlayers in order to achieve a desired thickness. The built-up thicknessof the conductive material 216 may be uniform throughout an applicationarea for conductive material 208, or have variable thickness within theapplication area for conductive material 208. Flow proceeds to block312.

At block 312, simultaneous with the 3D printer applying the conductivematerial 216, the 3D printer applies conductive diamonds 120 over theconductive material 216. In one embodiment, the 3D printer applies theconductive material 216 just prior to applying the conductive diamonds120. In another embodiment, the 3D printer applies the conductivematerial 216 to the same area 208 as the conductive diamonds 120, at thesame time. Where the conductive diamonds 120 are applied, preferably theconductive diamonds 120 are applied with a consistently even density.Flow proceeds to optional block 316.

At optional block 316, the conductive material 216 is cured. In oneembodiment, heat is used to cure the conductive material 216. In anotherembodiment, infrared energy (IR) is used to cure the conductive material216. In yet another embodiment, spray chemical compounds are used tocure the conductive material 216. Block 316 is optional since in someembodiments the conductive material 216 is self-curing and does notrequire the influence of a curing agent to set. Flow ends at optionalblock 316.

Finally, those skilled in the art should appreciate that they canreadily use the disclosed conception and specific embodiments as a basisfor designing or modifying other structures for carrying out the samepurposes of the present invention without departing from the spirit andscope of the invention as defined by the appended claims.

I claim:
 1. A system, comprising: a 3D printer, comprising: a firstdispenser, configured to apply conductive material to a surface; asecond dispenser, configured to apply conductive diamonds to a surface;the conductive material comprising a mixture of an elastomer and atleast one of nickel and silver; and the conductive diamonds between 1and 10 microns in size.
 2. The system of claim 1, wherein the 3D printerapplies the conductive material to the surface comprises the 3D printerconfigured to apply a plurality of successive layers of conductivematerial in order to build up a desired predetermined thickness ofconductive material.
 3. The system of claim 2, wherein a size of alargest diamond of the conductive diamonds is less than thepredetermined thickness of the conductive material.
 4. The system ofclaim 2, wherein the 3D printer is configured to apply the plurality ofsuccessive layers to an application area for conductive materialpredefined on the surface.
 5. The system of claim 4, wherein at leastone portion of less than all of the application area for conductivematerial receives a different predefined thickness of conductivematerial compared to a different portion of the application area forconductive material.
 6. The system of claim 1, wherein the conductivematerial comprises a plurality of layers of conductive polymers.
 7. Thesystem of claim 1, wherein in response to the 3D printer applies theconductive layer and conductive diamonds, the conductive material iscured, wherein the second dispenser applies the conductive diamonds overthe conductive material prior to the conductive material is cured. 8.The system of claim 1, wherein the second dispenser is configured toapply the conductive diamonds simultaneously to the first dispenserapplies the conductive material.
 9. The system of claim 1, wherein the3D printer is configured to apply the conductive diamonds through thesecond dispenser with a compressed gas under pressure.
 10. The system ofclaim 1, wherein the 3D printer is configured to apply the conductivediamonds through the second dispenser with a solvent in aerosol form.